Ultrasonic bonding of security device to a substrate to prevent harvesting
A security document (200) includes a substrate (205) having a first surface and a second surface opposite to the first surface, the first surface having a cellulosic material. The security document further includes an optical security device (220) having optical indicia of authenticity of the securi...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A security document (200) includes a substrate (205) having a first surface and a second surface opposite to the first surface, the first surface having a cellulosic material. The security document further includes an optical security device (220) having optical indicia of authenticity of the security document and a third surface, the third surface having a thermoplastic polymer. The security document also includes an ultrasonic weld (225) forming a bond between a section of the first surface and a section of the third surface. |
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