A heat pump

The present disclosure relates to a heat pump (100) including a compressor (101) for compressing a refrigerant, a first heat exchanger (102), a main expansion mechanism (103) and a second heat exchanger (104) arranged in a refrigeration path (120), the compressor having a suction port (101a), a comp...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHIKAMI, Hideo, VAN DE VYVER, Jasper, HATTIANGADI, Akshay
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:The present disclosure relates to a heat pump (100) including a compressor (101) for compressing a refrigerant, a first heat exchanger (102), a main expansion mechanism (103) and a second heat exchanger (104) arranged in a refrigeration path (120), the compressor having a suction port (101a), a compression port (101c) and an injection port (101b); a gas injection valve (112) connected on a first side (112a) to the refrigeration path between the first heat exchanger and the main expansion mechanism and on a second side (112b) to the injection port of the compressor; a liquid injection valve (111) connected on a first side (111a) to the refrigeration path between the first heat exchanger and the main expansion mechanism and on a second side (111b) between the second heat exchanger and the suction port of the compressor; and a controller (130), the controller (130) being configured to operate the gas injection valve (112) to inject at least partly gaseous refrigerant into the compressor through the injection port, and to operate the liquid injection valve (111) to inject substantially liquid refrigerant into the compressor through the suction port of the compressor.