Heat pump device

A refrigerant-circuit-comprising heat pump device according to the present invention comprising: valves (1017, 1018) that maintain the degree of opening thereof when not powered; a valve actuator circuit (1322) for operating the valves (1017, 1018); a valve control unit (1324) for controlling the va...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: OHTANI, Atsushi, FUJIMOTO, Yuusuke, TAOKA, Kentaroh, CORNELIS, Kevin, TOYOTA, Ryuuichi, STEEN, David
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A refrigerant-circuit-comprising heat pump device according to the present invention comprising: valves (1017, 1018) that maintain the degree of opening thereof when not powered; a valve actuator circuit (1322) for operating the valves (1017, 1018); a valve control unit (1324) for controlling the valve actuator circuit (1322); and a power circuit (PW) for supplying power to the valve actuator circuit (1322). The power circuit (PW) includes a first power circuit part (P1) that receives externally-supplied power to generate DC voltage, and a backup second power circuit part (P2). The second power circuit part (P2) receives and stores externally-supplied power in a capacitor, and connects the capacitor in parallel to a first output line (L1) of the first power circuit part (P1).