Tackified and filled silicone adhesive compositions

The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typicall...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HACKBARTH, Kent C, KINNING, David J, KHODAPARAST, Payam, RUNGE, Michael B, MACKEY, Sonja S
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typically fumed silica. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer, a silicate tackifying resin in an amount of between about 10 wt% and about 70 wt%, and inorganic particle filler in between about 0.1 wt% and about 20 wt%; a silicone polyurea block copolymer, a silicate tackifying resin in an amount of between about 10 wt% and about 70 wt%, and inorganic particle filler in an amount between about 0.1 wt% and about 20 wt%; and an addition cure silicone, a silicate tackifying resin in an amount of between about 10 wt% and about 70 wt%, and inorganic particle filler in an amount between about 0.1 wt% and about 20 wt%.