Tackified and filled silicone adhesive compositions
The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typicall...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typically fumed silica. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer, a silicate tackifying resin in an amount of between about 10 wt% and about 70 wt%, and inorganic particle filler in between about 0.1 wt% and about 20 wt%; a silicone polyurea block copolymer, a silicate tackifying resin in an amount of between about 10 wt% and about 70 wt%, and inorganic particle filler in an amount between about 0.1 wt% and about 20 wt%; and an addition cure silicone, a silicate tackifying resin in an amount of between about 10 wt% and about 70 wt%, and inorganic particle filler in an amount between about 0.1 wt% and about 20 wt%. |
---|