Active Convection Heat Dissipation Structure

An active convection heat dissipation structure is applicable for a vertical network 5 communication electronic device having a housing and printed circuit boards. Top and bottom portions of the housing are furnished with upper and bottom through holes, respectively. The printed circuit board is ver...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WU, Chin-Yi, CHU, Yung-Ching, CHEN, Sheng-Chung
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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