Active Convection Heat Dissipation Structure

An active convection heat dissipation structure is applicable for a vertical network 5 communication electronic device having a housing and printed circuit boards. Top and bottom portions of the housing are furnished with upper and bottom through holes, respectively. The printed circuit board is vertically mounted inside the housing and furnished with heat generating member. The active convection heat dissipation structure includes a chamber inside the housing is a hollow tube shape structure 10 consisted at least of one lateral wall. The chamber has a bottom as air inlet and a top as an air outlet communicated spatially with the air inlet to form a vertical convection path. The air inlet is communicated spatially with the bottom through holes, and the air outlet is communicated spatially with the upper through holes. An outer surface of the lateral wall is attached to the corresponding heat generating member on the printed circuit 15 board.