CHIP CARD MANUFACTURING METHOD, AND CHIP CARD OBTAINED BY SAID METHOD

CHIP CARD MANUFACTURING METHOD, AND CHIP CARD OBTAINED BY SAID METHOD

The invention relates to a chip card manufacturing method. According to said method, the following are produced: a module comprising a substrate supporting 5 contacts on one surface and conductive paths and a chip on the other; and an antenna on a holder, the antenna comprising a contact pad for res...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Paul, Christophe, Eymard, Eric, Guerineau, Nicolas, Proye, Cyril
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
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Beschreibung
Zusammenfassung:The invention relates to a chip card manufacturing method. According to said method, the following are produced: a module comprising a substrate supporting 5 contacts on one surface and conductive paths and a chip on the other; and an antenna on a holder, the antenna comprising a contact pad for respectively connecting to each of the ends thereof. A solder drop is placed on each of the contact pads of the antenna. The holder of the antenna is then inserted between plastic layers. A cavity is provided, in which the module can be accommodated and the 10 solder drops remains accessible. The areas of the module that are located on the solder drops are then heated such as to melt the solder and to solder the contact pads of the antenna to conductive pads of the module.