Hot melt adhesive for polyolefin films

The invention relates to a hot melt adhesive, containing a) 25 to 95 wt.%, preferably 50 to 85 wt.% of at least one polyolefin polymer; b) 1 to 75 wt.%, preferably 1 to 40 wt.% of at least one tackifier resin; c) 0 to 15 wt.% of at least one plasticizer; and d) 0 to 30 wt.% of at least one additive...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Klingberg, Wolfgang, Mills, Kevin, Hubenthal, Marcel, Swain, Andy, Strenger, Stefan, Klewe, Oliver, Purkner, Eckhard, Eckers, Mario, Thomas, Julia, Schrottle, Michael, Caspers, Alexander, Easdown, George, Herlfterkamp, Bernhard
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to a hot melt adhesive, containing a) 25 to 95 wt.%, preferably 50 to 85 wt.% of at least one polyolefin polymer; b) 1 to 75 wt.%, preferably 1 to 40 wt.% of at least one tackifier resin; c) 0 to 15 wt.% of at least one plasticizer; and d) 0 to 30 wt.% of at least one additive and/or additional ingredient selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, or combinations thereof, characterized in that the at least one polyolefin polymer is a mixture of: a1) at least one first polyolefin polymer having a molecular weight M