Bonding of composite materials

A composite bonding process is disclosed. At least one of two curable, resin-based composite substrates is partially cured to a degree of cure of at least 10% but less than 75% of full cure. The composite substrates are then joined to each other with a curable adhesive there between. Co-curing of th...

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Bibliographische Detailangaben
Hauptverfasser:	MACADAMS, LEONARD A, KOHLI, DALIP K
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BLASTING CHEMISTRY DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING DYES ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES LIGHTING MECHANICAL ENGINEERING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THERMAL INSULATION IN GENERAL TRANSPORTING USE OF MATERIALS AS ADHESIVES WEAPONS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A composite bonding process is disclosed. At least one of two curable, resin-based composite substrates is partially cured to a degree of cure of at least 10% but less than 75% of full cure. The composite substrates are then joined to each other with a curable adhesive there between. Co-curing of the joined substrates is carried out to form a bonded composite structure, whereby the adhesive is chemically bonded to and mechanically diffused with the resin matrix of the composite substrates, resulting in a chemically bonded interface between the adhesive and each composite substrate. Furthermore, bonding can occur with the presence of contaminants on the joined surfaces.