Packaging film configured for stress distribution

A flexible packaging film is provided that exhibits a high level of internal stress distribution where all layers combine to dissipate and distribute stress internally to provide improved scratch and puncture resistance. The flexible packaging film is a multi-layer film that is configured to retain...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KINIGAKIS, PANAGIOTIS, LIANG, YING (LORA)
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A flexible packaging film is provided that exhibits a high level of internal stress distribution where all layers combine to dissipate and distribute stress internally to provide improved scratch and puncture resistance. The flexible packaging film is a multi-layer film that is configured to retain its integrity and distribute stress over a large area where all layers within the film laminate react in a similar manner to stress. The film comprises: an outer layer of a peelable sealant layer containing organoclay for forming a heat seal; a lower base layer including a metalized polymer with a metal applied to at least one surface of a polymer layer; a co-extruded tie layer between the outer layer and the lower base layer, the co-extruded tie layer including one or more layers of polyethylene and one or more layers of ethylene acrylic acid; the ethylene acrylic acid bonded to the metal of the metalized polymer in the lower base layer; and a thickness ratio of the polyethylene to the ethylene acrylic acid from 1 to 5.