Mixed mode ligands

Substrates comprising a solid support, a ligand, and a linker comprising at least one C, 0, N, or S atom covalently connecting the solid support to the ligand, are disclosed, along with methods of using and making the substrates, and devices including the substrates.

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Bibliographische Detailangaben
Hauptverfasser:	NOCHUMSON, SAMUEL, AIT-HADDOU, HASSAN, ONYEMAUWA, FRANK, HAIGH, JONATHAN
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMISTRY CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS METALLURGY ORGANIC CHEMISTRY PEPTIDES PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEPARATION TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	Substrates comprising a solid support, a ligand, and a linker comprising at least one C, 0, N, or S atom covalently connecting the solid support to the ligand, are disclosed, along with methods of using and making the substrates, and devices including the substrates.