Bonding using hot-melt adhesives
The invention relates to the use of a hot-melt adhesive having high hardness for bonding metal, paper and/or plastic films or foils. The invention further relates to a method for bonding a metal, paper and/or plastic film or foil to a substrate.
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The invention relates to the use of a hot-melt adhesive having high hardness for bonding metal, paper and/or plastic films or foils. The invention further relates to a method for bonding a metal, paper and/or plastic film or foil to a substrate. |
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