Bonding wood composites with resin solids-fortified phenol-formaldehyde resin

The invention comprises an aqueous phenol-formaldehyde resole resin liquid fortified with powdered (., spray dried) phenol-formaldehyde resole resin, preparing wood composites, particularly oriented strand board (OSB), waferboard, particleboard, medium density fiber board, and hardboard, using the s...

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Bibliographische Detailangaben
Hauptverfasser:	YEAGER, DANIEL C, KENNEDY, HERBERT J, BREHMER JR., HARMON E, KNIGHT, JAMES H, BREYER, ROBERT A
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention comprises an aqueous phenol-formaldehyde resole resin liquid fortified with powdered (., spray dried) phenol-formaldehyde resole resin, preparing wood composites, particularly oriented strand board (OSB), waferboard, particleboard, medium density fiber board, and hardboard, using the solids-fortified liquid resin, and related wood composites bonded with the solids-fortified resin.