Plate synthesized by waste circuit board powder and manufacturing process thereof

Plate synthesized by waste circuit board powder and the manufacturing process thereof are provided. The material used for manufacturing the plate includes: powder recycled from circuit board, wood fiber powder, crosslinker, waterproof agent and carbon filament fiber. The manufacturing process includes the following steps: drying the powder recycled from circuit board at a constant temperature; processing the high-fiber auxiliary materials into wood fiber powder with a particle size of over 80 mesh, drying and then stirring the wood fiber powder to obtain carbon fiber powder; adding processing agents and mixing uniformly again; charging the mixed material into a paving system, pressing, placing, repressing and then relieving pressure. The plate has good processing properties, high water resistance, high fire resistance and high static bending strength.