Method and product for cutting materials

The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percen...

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Bibliographische Detailangaben
Hauptverfasser:	BRANAGAN, DANIEL JAMES, PARATORE, DAVID
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BROACHING CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FERROUS OR NON-FERROUS ALLOYS FILING GRINDING LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PLANING POLISHING SAWING SCRAPING SHEARING SLOTTING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140 µm or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate.