METHOD OF CONNECTING MODULE LAYERS SUITABLE FOR THE PRODUCTION OF MICROSTRUCTURE COMPONENTS AND A MICROSTRUCTURE COMPONENT

Process for connecting microstructured component layers made from metals and metal alloys comprises: (a) applying a multifunctional barrier layer on the joining surfaces of the component layers; (b) applying a solder layer on the barrier layer; (c) stacking the component layers; and (d) soldering un...

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Bibliographische Detailangaben
Hauptverfasser:	CARSTEN SCHWIEKENDICK, HEINRICH MEYER, OLIVER RINGTUNATUS, KONRAD CRAMER, OLAF KURTZ, WOLFGANG FRIZ, CHRISTIAN MADRY, RALF HERBER
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Process for connecting microstructured component layers made from metals and metal alloys comprises: (a) applying a multifunctional barrier layer on the joining surfaces of the component layers; (b) applying a solder layer on the barrier layer; (c) stacking the component layers; and (d) soldering under the action of heat. An Independent claim is also included for a microstructured component comprising a stack of microstructured component layers having a barrier layer and solder layer between them.