THERMALLY-FORMABLE AND CROSS-LINKABLE PRECURSOR OF A THERMALLY CONDUCTIVE MATERIAL

The invention relates to a thermally-formable and cross-linkable precursor of a thermally-conductive material comprising a) one or more crosslinkable polymers where the melt flow index of the polymer or mixture of polymers (measured at 190 DEG C according to ASTM D-1238), respectively, is 10-100 g/1...

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Bibliographische Detailangaben
Hauptverfasser:	PETER WEBER, UWE BOELZ, STEFAN R., REIMANN
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to a thermally-formable and cross-linkable precursor of a thermally-conductive material comprising a) one or more crosslinkable polymers where the melt flow index of the polymer or mixture of polymers (measured at 190 DEG C according to ASTM D-1238), respectively, is 10-100 g/10 min and b) one or more thermally-conductive fillers in an amount of at least 60 wt. % of the total weight of the precursor.