MOUNTING CAPACITORS UNDER BALL GRID ARRAY

An apparatus is disclosed. The apparatus has a printed circuit board and one or several integrated circuit substrates mounted to the printed circuit board. At least one SMT component with two or more terminals is arranged between the printed circuit board and the package. In one embodiment, the SMT...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHEE-YEE CHUNG, ERIK PETER, ALEXANDER WAIZMAN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An apparatus is disclosed. The apparatus has a printed circuit board and one or several integrated circuit substrates mounted to the printed circuit board. At least one SMT component with two or more terminals is arranged between the printed circuit board and the package. In one embodiment, the SMT component replaces interconnects in the ball grid array used to mount the substrate to the printed circuit board while simultaneously connecting the SMT terminals to the substrate and the printed circuit board. The disclosed apparatus of SMT components mount results in significant reduction of inductance of the SMT connection to the substrate.