SEMI-CONDUCTOR COMPONENT WITH AN ENCAPSULATION MADE OF ELASTIC MATERIAL

SEMI-CONDUCTOR COMPONENT WITH AN ENCAPSULATION MADE OF ELASTIC MATERIAL

The invention relates to a semi-conductor component comprising a semi-conductor chip and an encapsulation for protecting the chip from damages. The encapsulation is made of an elastic material, for example, silicon.

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Hauptverfasser: BERND GEBHARD, PETER MUHLECK, HEINZ NATHER, JURGEN RIEDEL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator BERND GEBHARD
PETER MUHLECK
HEINZ NATHER
JURGEN RIEDEL
description The invention relates to a semi-conductor component comprising a semi-conductor chip and an encapsulation for protecting the chip from damages. The encapsulation is made of an elastic material, for example, silicon.
format Patent
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMI-CONDUCTOR COMPONENT WITH AN ENCAPSULATION MADE OF ELASTIC MATERIAL
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