SEMI-CONDUCTOR COMPONENT WITH AN ENCAPSULATION MADE OF ELASTIC MATERIAL

The invention relates to a semi-conductor component comprising a semi-conductor chip and an encapsulation for protecting the chip from damages. The encapsulation is made of an elastic material, for example, silicon.

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Bibliographische Detailangaben
Hauptverfasser:	BERND GEBHARD, PETER MUHLECK, HEINZ NATHER, JURGEN RIEDEL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a semi-conductor component comprising a semi-conductor chip and an encapsulation for protecting the chip from damages. The encapsulation is made of an elastic material, for example, silicon.