Method and apparatus for planarizing a semiconductor wafer

A method for planarizing a semiconductor wafer includes providing a fluid on a surface of the wafer, the fluid containing particles, and generating a field to apply a force to the particles, the force having a component that is normal to the surface such that the particles contact the surface to rem...

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Bibliographische Detailangaben
1. Verfasser:	DAVID K. WATTS
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for planarizing a semiconductor wafer includes providing a fluid on a surface of the wafer, the fluid containing particles, and generating a field to apply a force to the particles, the force having a component that is normal to the surface such that the particles contact the surface to remove material therefrom. Alternative methods, semiconductor devices and semiconductor processing apparatuses are also disclosed.