Low application temperature hot melt adhesive

A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of...

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Bibliographische Detailangaben
Hauptverfasser:	MICHAEL G. HARWELL, QIWEL HE, RYAN, A. LEISA, CHARLES W. PAUL, MARIA XENIDOU, MATTHEW L. SHARAK
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BRAIDING CHEMISTRY COTTON-WOOL DYES FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS KNITTING LACE-MAKING MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL NON-WOVEN FABRICS PAINTS POLISHES TEXTILES TRIMMINGS USE OF MATERIALS AS ADHESIVES WADDING
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Beschreibung
Zusammenfassung:	A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).