POLYMER BLEND BASED ON POLYAMIDE

A molding composition that features low water absorption, low thermal expansion and mold shrinkage is disclosed. The composition that optionally contains fillers or reinforcing agents contains polyamide, an impact modifier and a member selected from the group consisting of phenol-formaldehyde resin,...

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Bibliographische Detailangaben
Hauptverfasser:	DETLEV JOACHIMI, MARC VATHAUER
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A molding composition that features low water absorption, low thermal expansion and mold shrinkage is disclosed. The composition that optionally contains fillers or reinforcing agents contains polyamide, an impact modifier and a member selected from the group consisting of phenol-formaldehyde resin, an oligomeric or polymeric compound having at least 2 phenolic hydroxyl groups per molecule. Further optional components are compatibility promoter and a vinyl (co)polymer.