HIGH-DENSITY INTERCONNECTION OF TEMPERATURE SENSITIVE ELECTRONIC DEVICES

Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed.

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Bibliographische Detailangaben
Hauptverfasser:	JOHN, W. MARCINIEC, KENNETH, R. ERIKSON
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed.