Encapsulated integrated circuit package and method of manufacturing an integrated circuit package

Encapsulated integrated circuit package and method of manufacturing an integrated circuit package

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Hauptverfasser: EDWARD G. COMBS, CHUN HO FAN, TSANG KWOK CHEUNG, CHOW LAP KEUNG, SADAK THAMBY LABEEB, NEIL ROBERT MCLELLAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator EDWARD G. COMBS
CHUN HO FAN
TSANG KWOK CHEUNG
CHOW LAP KEUNG
SADAK THAMBY LABEEB
NEIL ROBERT MCLELLAN
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
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