Method for embedding an ic component into a foamed layer of chip card

The invention relates to a method for producing monolayer and multilayer chip cards (1) and to a method for producing a semi-finished product for chip cards and to a corresponding semi-finished product. Cavities (21) are embossed into a foamed plastic material (20). The electronic components (30) of...

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Bibliographische Detailangaben
Hauptverfasser:	JOACHIM HOPPE, RUDOLF ZAPF, JOSEF STRASSMAIER, ARNO HOHMANN
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention relates to a method for producing monolayer and multilayer chip cards (1) and to a method for producing a semi-finished product for chip cards and to a corresponding semi-finished product. Cavities (21) are embossed into a foamed plastic material (20). The electronic components (30) of the chip cards are inserted into said cavities. The pre-embossed, foamed plastic material (20) may be used as a monolayer chip or, if provided with the electronic components, as a card inlet for a monolayer card or a laminate card. The production of cavities for the electronic components by deep-embossing foamed plastic material is inexpensive and subjects the electronic components to a minimum of mechanical stress. The embossing method facilitates the production of cavities having complex geometrical shapes.