DIPHASE POLYMERIC SUBSTRATE FOR ELECTROLESS DEPOSITION

The mixing of at least two liquid components to give a liquid mixture which contains polyfunctional, partly ethylenically unsaturated molecules and subsequent polymerisation of the mixture gives a solid two-phase polymerisation product. The product contains a disperse solid phase containing ethyleni...

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Bibliographische Detailangaben
1. Verfasser:	EDWARD J. LEECH
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	The mixing of at least two liquid components to give a liquid mixture which contains polyfunctional, partly ethylenically unsaturated molecules and subsequent polymerisation of the mixture gives a solid two-phase polymerisation product. The product contains a disperse solid phase containing ethylenic double bonds, by means of which this phase is oxidatively degradable, and a second continuous solid phase which is resistant to oxidative degradation and in which the first phase is dispersed. Surfaces of this material are suitable for currentless deposition of metal layers having particularly good adhesion, for example for the production of printed circuits.