ELEKTROPLATTIERUNGSBAD UND VERFAHREN ZUM STABILHALTEN DER ZUSAMMENSETZUNG DER PLATTIERTEN LEGIERUNG

A plating bath and process for electroplating coatings of palladium nickel alloys on a conductive substrate at current densities in the range of 10 amps/sq. ft. to 150 amps/sq. ft. wherein the palladium content of the alloy remains substantially constant despite current density variations during pla...

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Bibliographische Detailangaben
Hauptverfasser:	GRAHAM, ARTHUR HUGHES, KEATING, KENNETH BERNARD
Format:	Patent
Sprache:	eng ; ger
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	A plating bath and process for electroplating coatings of palladium nickel alloys on a conductive substrate at current densities in the range of 10 amps/sq. ft. to 150 amps/sq. ft. wherein the palladium content of the alloy remains substantially constant despite current density variations during plating. The alloy composition stability is achieved by adding at least about 15 parts per million of iodide ions to the plating bath.