HERSTELLUNGSTECHNIKEN FÜR ELEKTRISCHE EINRICHTUNG

The present invention relates to a method of making an RFID transponder comprising: placing a chip having a bottom surface and a top surface on a thermoplastic substrate with the bottom surface of the chip contacting a top surface of the thermoplastic substrate; heating at least one of the thermoplastic substrate or chip with thermal radiation thereby elevating the temperature of the thermoplastic substrate and consequently softening the thermoplastic substrate; embedding the chip into the thermoplastic substrate by applying pressure to the chip while the substrate is heated to the elevated temperature; and coupling the chip to an antenna structure, wherein the coupling includes: depositing the antenna structure with conductive ink onto the thermoplastic substrate; and connecting the antenna structure to the interposer leads of the RFID interposer.