VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS MIT UNTERSCHIEDLICH STARK DOTIERTEN BEREICHEN
The method involves forming a layer (58), which inhibits diffusion of a dopant. The dopant is penetrated into the layer on a portion of the surface of a semiconductor component material (50). A diffusion-inhibiting layer in a highly doped region (62) is partially removed. The dopant source (66) is f...
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Zusammenfassung: | The method involves forming a layer (58), which inhibits diffusion of a dopant. The dopant is penetrated into the layer on a portion of the surface of a semiconductor component material (50). A diffusion-inhibiting layer in a highly doped region (62) is partially removed. The dopant source (66) is formed on the diffusion-inhibiting layer in the highly doped region and the dopant is diffused from the dopant source into the semiconductor component material. The dopant is made up of phosphorus or boron. |
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