BINDEKOPF FÜR EINEN SCHWEREN DRAHTBONDER MIT EINEM ERSTEN MODUL UND EINEM ZWEITEN ABSPERRBAREN/UNABSPERRBAREN MODUL

A bonding apparatus (10) for bonding a length of wire comprises a first module (14) which is drivable along a linear axis towards and away from a bonding point and a second module (16) slidably mounted to the first module (14). A wire cutter (36) is mounted to the first module (14) and a bonding too...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MAK, TIM WAI, CHENG, CHI WAH, NG, HON KAM
Format: Patent
Sprache:ger
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Beschreibung
Zusammenfassung:A bonding apparatus (10) for bonding a length of wire comprises a first module (14) which is drivable along a linear axis towards and away from a bonding point and a second module (16) slidably mounted to the first module (14). A wire cutter (36) is mounted to the first module (14) and a bonding tool (32) is mounted to the second module (16). A coupling mechanism is operative to lock the second module (16) in fixed relative position to the first module (14), and to unlock the second module (16) from its fixed relative position to the first module (14) so that the second module (16) is slidable relative to the first module (14) in directions parallel to the linear axis.