ELEKTRISCHES BAUELEMENT IN CHIP-BAUWEISE

1. Electrical component (11, 23) in the form of a chip which consists of a wafer-shaped body (12, 24) of electrically effective material which is provided on its opposing end faces with coverings (13, 14, 32, 34), which has connector elements (20, 21, 38, 39) for connecting the coverings of opposite polarity to contact points (7, 8) of a printed circuit, and which is provided with an insulating coating, characterized by the features : a) each covering (13, 14, 32, 34) of the same polarity is located on only one end face of the body (12, 24) and covers the latter completely up to the side faces (15, 16) or leaves free an insulating strip (40, 41) to the side face (15, 16), b) the body (12, 24) provided with the coverings (13, 14, 32, 34) is surrounded by an insulating coating (17, 35) which, on the coverings (13, 14, 32, 34), contains one free area (18, 19, 36, 37) in each case in the vicinity of the two side faces (15, 16) of the body (12, 24), which free areas are offset one against another like rotary mirror images, c) the connector elements (20, 21, 38, 39) are cap-shaped, consist of conductive and solderable material and are in each case in electrical contact with a covering (13 or 14, 32 or 34) in the region of the free areas (18, 19, 36, 37) of the insulating coating (17, 35).