VORRICHTUNG ZUM VERLÖTEN VON KONTAKTEN AUF HALBLEITERCHIPS

A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, having a plate with a window, a gas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	HUEBNER, HOLGER, BERGMANN, ROBERT
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS OF DOMESTIC STOVES OR RANGES, OF GENERAL APPLICATION DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR OTHER DOMESTIC STOVES OR RANGES PERFORMING OPERATIONS PRINTED CIRCUITS RANGES SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING VENTILATING WEAPONS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A device for soldering contacts on semiconductor chips. A chip is held on a chip mount by a chuck and is heated from a side facing away from the wafer by means of a radiation source, so that a solder applied to a side facing the wafer is melted. A flushing device, having a plate with a window, a gas channel, and a gas outlet opening for a forming gas, is arranged at the window, is fitted parallel to the wafer. The chip is moved vertically in relation to the wafer, pressed onto the wafer through the window, and soldered on by means of isothermal solidification.