BILDEN EINER INTEGRIERTEN MEHRSEGMENTSCHALTUNG MIT ISOLIERTEN SUBSTRATEN

BILDEN EINER INTEGRIERTEN MEHRSEGMENTSCHALTUNG MIT ISOLIERTEN SUBSTRATEN

Methods of forming a multi-segment chip or integrated circuit device are provided. The multi-segment chip may comprise at least two blocks, such as an analog integrated circuit block and a digital integrated circuit block, with substrates that are isolated from each other. Thus, each block may have...

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Bibliographische Detailangaben
1. Verfasser: ATLAS, EUGENE
Format: Patent
Sprache:ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Methods of forming a multi-segment chip or integrated circuit device are provided. The multi-segment chip may comprise at least two blocks, such as an analog integrated circuit block and a digital integrated circuit block, with substrates that are isolated from each other. Thus, each block may have independent operation voltage or other characteristics.