ELEKTROLYTISCHES VERFAHREN ZUM FÜLLEN VON LÖCHERN UND VERTIEFUNGEN MIT METALLEN

ELEKTROLYTISCHES VERFAHREN ZUM FÜLLEN VON LÖCHERN UND VERTIEFUNGEN MIT METALLEN

Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition elect...

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Bibliographische Detailangaben
Hauptverfasser: WENZEL, RENE, YOUKHANIS, MARKUS, MAGAYA, TAFADZWA, ROELFS, BERND, REENTS, BERT, KIM, SOUNGSOO
Format: Patent
Sprache:ger
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Beschreibung
Zusammenfassung:Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.