SCHMELZKLEBSTOFF

Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.

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Bibliographische Detailangaben
Hauptverfasser:	MOELLER, THOMAS, EBERHARDT, RALF, SCHOLTA, RICHARD, HOFFMANN, GUNTER, GRAUEL, RALF
Format:	Patent
Sprache:	ger
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Hot-melt adhesives containing at least one aromatic modified polyethylene and/or polypropylene (co)polymer, a further ethylene or propylene/C4 to C20 alpha-olefin copolymer, and at least one tackifying resin are useful for the adhesive bonding of package and paperboard products.