VORRICHTUNG UND VERFAHREN ZUM KÜHLEN BANDFÖRMIGER SUBSTRATE

VORRICHTUNG UND VERFAHREN ZUM KÜHLEN BANDFÖRMIGER SUBSTRATE

The invention relates to a device and a method for cooling strip substrates in vacuo, whereby a substrate (1) is run such as to wrap around a convex cooling surface, at least partly in a contact region (3) and a gap (10) is formed between the substrate (1) and the cooling surface in the contact regi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WEISKE, DIETER, METZNER, CHRISTOPH, HEINSS, JENS-PETER, KUEHN, GERHARD
Format: Patent
Sprache:ger
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to a device and a method for cooling strip substrates in vacuo, whereby a substrate (1) is run such as to wrap around a convex cooling surface, at least partly in a contact region (3) and a gap (10) is formed between the substrate (1) and the cooling surface in the contact region (3), whereby, in at least one first region (11) of the gap (10), a fluid is introduced through the cooling surface and said fluid is at least partly drained through the cooling surface from at least one second region (12; 13) of the gap (10).