BAUELEMENT AUS LEITENDEM POLYMER UND VERFAHREN ZU SEINER HERSTELLUNG

An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer ( 12 ), a second metal layer ( 14 ), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material ( 40 ) substantially covers the first metal layer ( 12 ). A third metal layer ( 48 ) is provided on the first layer of insulating material ( 40 ). This third metal layer ( 48 ) is divided to provide a first terminal ( 90 ) and a second terminal ( 92 ). The first terminal ( 90 ) is electrically connected to the first metal layer ( 12 ) by a conductive interconnect ( 84 ) formed through said first layer of insulating material ( 40 ), and the second terminal ( 92 ) is electrically connected to said second metal layer ( 14 ) by a conductive path ( 68 ) comprising an insulated conductive channel which passes through and is insulated from said first metal layer ( 12 ) and said at least one layer of device material ( 16 ). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.