BAUELEMENTANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER BAUELEMENTANORDNUNG

BAUELEMENTANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER BAUELEMENTANORDNUNG

In a component assembly and method for producing the same, the component assembly includes at least one component arranged on a support subframe, e.g., a printed circuit board. An insulator enclosing the component and including two isolating superimposed layers is also arranged on the support substr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: OBERMAYER, FLORIAN, RISSING, LUTZ
Format: Patent
Sprache:ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:In a component assembly and method for producing the same, the component assembly includes at least one component arranged on a support subframe, e.g., a printed circuit board. An insulator enclosing the component and including two isolating superimposed layers is also arranged on the support substrate. A sealing mass covering the component is arranged inside the insulator. The two or more isolating layers are made from the same isolating material and connected at the contact area.