SPRUDELVORRICHTUNG MIT ZWEI FRITTEN

A dual chambered bubbler vessel (20) for use with solid organometallic source material for chemical vapor phase deposition systems, and a method for transporting a carrier gas saturated with source material for delivery into such systems. The bubbler vessel is designed so that carrier gas enters thr...

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Bibliographische Detailangaben
Hauptverfasser:	O'GRADY, JOHN, RANGARAJAN, SRI PRAKASH
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A dual chambered bubbler vessel (20) for use with solid organometallic source material for chemical vapor phase deposition systems, and a method for transporting a carrier gas saturated with source material for delivery into such systems. The bubbler vessel is designed so that carrier gas enters through an inlet (24) in the top thereof into an inlet chamber (28) and after it has been saturated with the organometallic vapors exits through a first porous frit (32) located in the floor (27) of the inlet chamber (28) into an outlet chamber (29) and is withdrawn from the bubbler after passing through a second porous frit element (33) located at the outlet (25) of the bubbler.