VERFAHREN ZUR HERSTELLUNG VON FORMKOERPERN AUF SIC-BASIS DURCH VERBINDEN VORGEFERTIGTER TEILKOERPER

Component bodies of silicon carbide base material, at least in their surface layers, are welded together without the provision of a binder at finely polished joining surfaces by virtue of the fact that at least one of the joint surfaces is of a silicon carbide material containing an excess of silico...

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Bibliographische Detailangaben
Hauptverfasser: GYARMATI, ERNOE, MUENZER, RUDOLF, GUPTA, ASHOK KUMAR, KREUTZ, HERMANN, NAOUMIDIS, ARISTIDES
Format: Patent
Sprache:ger
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Zusammenfassung:Component bodies of silicon carbide base material, at least in their surface layers, are welded together without the provision of a binder at finely polished joining surfaces by virtue of the fact that at least one of the joint surfaces is of a silicon carbide material containing an excess of silicon (SiSiC). The component bodies are kept closely fitted together especially by an additional pressing force of at least 0.1 kg/cm2 during a heating stage at atmospheric or lower pressure at a temperature in the range from 1500 DEG C. to 1800 DEG C. for 15 to 100 minutes in an inert atmosphere, the excess of silicon at the boundary making it possible for silicon carbide crystal growth to take place across the boundary.