POLYPROPYLENFORMMASSEN

Moulding materials (I) comprise (A) polymers of propylene and ≤ 20 wt.% other monomers, contg. (B) 0.05-0.4 wt.% mono- or poly-basic carboxylic acid amide(s) with a mol. wt. of 150-600 and (C) 0.1-3.0 wt.% ethylene polymer with ≤ 20 wt.% comonomers, with a density of 0.890-0.945 g/cm and a MFI 190/2...

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Bibliographische Detailangaben
Hauptverfasser:	SEILER, ERHARD, SCHOENE, WERNER
Format:	Patent
Sprache:	ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	Moulding materials (I) comprise (A) polymers of propylene and ≤ 20 wt.% other monomers, contg. (B) 0.05-0.4 wt.% mono- or poly-basic carboxylic acid amide(s) with a mol. wt. of 150-600 and (C) 0.1-3.0 wt.% ethylene polymer with ≤ 20 wt.% comonomers, with a density of 0.890-0.945 g/cm and a MFI 190/2.16 of 10-100 g/10 mins.. Also claimed are films and mouldings made from (I), such as injection syringes. Pref. (A) is a polypropylene homopolymer or a copolymer of 90-99.9 wt.% propylene and 0.1-10 wt.% ethylene and/or 4-10C alk-1-ene. (B) is 13-docosenoic acid amide (erucamide) and/or 9-octadecenoic acid amide (oleamide), in amts. of 0.08-0.2 wt.%.