VERFAHREN ZUR DURCHKONTAKTIERUNG VON ZWEILAGIGEN LEITERPLATTEN UND MULTILAYERN

Process for fabricating plated-through double-layered printed-circuit boards and multilayers, employing polythiophenes as conductive fitting of the bores for direct through-connection by electroplating, and the printed-circuit boards and multilayers thus fabricated.

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Bibliographische Detailangaben
Hauptverfasser:	WOLF, GERHARD-DIETER, JONAS, FRIEDRICH
Format:	Patent
Sprache:	ger
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	Process for fabricating plated-through double-layered printed-circuit boards and multilayers, employing polythiophenes as conductive fitting of the bores for direct through-connection by electroplating, and the printed-circuit boards and multilayers thus fabricated.