DÜNNSCHICHTANORDNUNG UND VERFAHREN ZUM HERSTELLEN EINER SOLCHEN DÜNNSCHICHTANORDNUNG

The arrangement has a substrate and at least one electronic thin film component on a base electrode (4) on the substrate in the form of a circuit board (2) with an insulating material base body (3) and a metal lamination as a conducting coating forming the base electrode. The conducting coating is f...

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Bibliographische Detailangaben
Hauptverfasser:	WUCHSE MARKUS. DR, LEISING GUENTHER. DR, RIEDLER MANFRED. DR, FROSCH RONALD, HASLEBNER NIKOLAI
Format:	Patent
Sprache:	ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The arrangement has a substrate and at least one electronic thin film component on a base electrode (4) on the substrate in the form of a circuit board (2) with an insulating material base body (3) and a metal lamination as a conducting coating forming the base electrode. The conducting coating is flattened at least at the thin film component's position, at which there is a thin film contact coating physically and/or chemically absorbed on the surface of the base electrode. An independent claim is also included for the following: (A) a method of manufacturing an inventive arrangement.