Quality Issues in Chip-on-board (COB) Technology

Quality Issues in Chip-on-board (COB) Technology

Critical processing steps of COB manufacturing, as implemented at Epitek, are reported. They include testing of incoming boards, cleaning, bonding parameters, bonding defects and statistical process control.

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Veröffentlicht in:Microelectronics international 1994-02, Vol.11 (2), p.5-10
Hauptverfasser: Giani, E, Mathurin, J.P
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description Critical processing steps of COB manufacturing, as implemented at Epitek, are reported. They include testing of incoming boards, cleaning, bonding parameters, bonding defects and statistical process control.
doi_str_mv 10.1108/eb044525
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title Quality Issues in Chip-on-board (COB) Technology
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