Quality Issues in Chip-on-board (COB) Technology

Quality Issues in Chip-on-board (COB) Technology

Critical processing steps of COB manufacturing, as implemented at Epitek, are reported. They include testing of incoming boards, cleaning, bonding parameters, bonding defects and statistical process control.

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Bibliographische Detailangaben
Veröffentlicht in:Microelectronics international 1994-02, Vol.11 (2), p.5-10
Hauptverfasser: Giani, E, Mathurin, J.P
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
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Zusammenfassung:Critical processing steps of COB manufacturing, as implemented at Epitek, are reported. They include testing of incoming boards, cleaning, bonding parameters, bonding defects and statistical process control.
ISSN:1356-5362
DOI:10.1108/eb044525