Accuracy of Integrated Voltage Dividers in Plastic Packaged Linear ICs
This study attempts to quantify the loss of accuracy that arises after packaging and during the life of the IC device. To identify a solution to the problem of mismatch in voltage dividers, the characterisation of the amount of stress associated with commercially available moulding compounds was per...
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| Veröffentlicht in: | Microelectronics international 1985-04, Vol.2 (4), p.19-23 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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