Accuracy of Integrated Voltage Dividers in Plastic Packaged Linear ICs

This study attempts to quantify the loss of accuracy that arises after packaging and during the life of the IC device. To identify a solution to the problem of mismatch in voltage dividers, the characterisation of the amount of stress associated with commercially available moulding compounds was performed by means of silicon integrated strain gauges. In addition, the influence of the voltage divider lay-out was measured with a specifically designed test pattern. The possibility of producing circuits with an accuracy level better than 0·1% without trimming was demonstrated.