Thermal and Electro-Thermal Modeling and Simulation Techniques for Multichip Modules

This report results from a contract tasking Technical University of Budapest Department of Electron Devices as follows: The contractor will investigate the issues and problems of coupled electro-thermal M&S of Mixed Technology Multichip Modules (MT-MCMs). MT-MCMs for this project will be defined as a mixtures of high performance computing, microelectromechanical systems, and microfluidic systems. The use of M&S will be investigated for each of the generic steps of the design process flow as shown in the proposal. The contractor will determine the most cost effective M&S approach for each step in the design process. The possibilities of integrating the existing fast and accurate design tools of TUB into the AFRL design flow have to be investigated, and the optimal M&S approach determined.