1984 IR&D (Independent Research and Development) Advanced Packaging Study

An advanced multiyear electronic packaging project has been started. The project is a comprehensive interactive one involving theory, modeling, structure fabrication, and reliability testing. Highlights of the first year's activities are presented in this report. Important results include: the...

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Bibliographische Detailangaben
Hauptverfasser:	Clatterbaugh,G V, Charles,H C , Jr
Format:	Report
Sprache:	eng
Schlagworte:	ASSEMBLY CHIPS(ELECTRONICS) CONTROL Electrical and Electronic Equipment ELECTRONIC EQUIPMENT FABRICATION FINITE ELEMENT ANALYSIS FLOW HEIGHT INTEGRATED CIRCUITS LIFE SPAN(BIOLOGY) PACKAGING PREDICTIONS RELIABILITY SOLDERED JOINTS SOLDERING STRESSES STRUCTURAL PROPERTIES TEST AND EVALUATION THERMAL ANALYSIS THERMAL PROPERTIES THERMOMECHANICS VALIDATION
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Beschreibung
Zusammenfassung:	An advanced multiyear electronic packaging project has been started. The project is a comprehensive interactive one involving theory, modeling, structure fabrication, and reliability testing. Highlights of the first year's activities are presented in this report. Important results include: the creation of integrated thermal and thermomechanical models, the prediction of lifetimes under environmental and operational stress conditions, model verification and validation by carefully controlled experimentation, development of assembly techniques, and the invention of a new method for preparing controlled solder joint height and geometry. Keywords: Electronic packaging; VLSI/VHSIC packaging; Thermal analysis; Thermal modeling; Finite-element modeling; thermomechanical analysis; Chip carriers; Solder reflow.